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Modifying the leads of reed switches is a very delicate process and should be carried out by special tools which do not transfer shock into the contact or shift the sensitivity. We have the necessary tools to modify reed switches to the following formations, within the specified tolerances to suit different applications.
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The leads are gripped just outside the glass seals to prevent shock from transferring to the contacts, and the unwanted leads are cropped in one swift motion. Cropped reed switches can be used for soldering longer wires for encapsulation in customized housings.
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The leads are gripped just outside the glass seals, cropped to the required length, and then SMD formed. No flattening (which needs extra pressure that could damage the contacts) takes place as all reed switches are produced with flat leads. As a result, SMD formed reed switches have oriented internal blades for maximum in-group sensitivity. These devices are a cost effective solution to SMD reed sensors for applications without shock and vibration.
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The leads are gripped just outside the glass seals to prevent shock from transferring to the contacts, cropped to the require length, and then goal post formed. Blades are always oriented perpendicular to the formed leads for maximum in-group sensitivity. These devices are a cost effective solution to PCB mountable reed sensors for applications with stable environmental conditions.
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The leads are gripped just outside the glass seals to prevent shock form transferring to the contacts, cropped to the required length, and then L formed. This formation can be used for manufacturing welded and soldered assemblies.
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The leads are gripped just outside the glass seals to prevent shock form transferring to the contacts, cropped to the required length, and then L formed. The L formed assembly is welded to a non-magnetic wire and the final assembly is lead out plated for solderability after welding. These kinds of reed switches are suitable for vertical PCB mounting.
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Cropped reed switches are soldered to stripped and tinned wires. These assemblies can be encapsulated in plastic housings. This assembly, with a thin layer of a flexible and resilient compound is a cost effective alternative to proximity sensors in cylindrical housings.
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Download this data sheet
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