Reflow Soldering is a process of automatically soldering multiple devices on a PCB. This is usually done after components are automatically picked and placed on the PCB. When using a PCB with Reed Sensors in a reflow oven, some care should be taken so that the devices are not damaged.
We recommend that the above temperature curve be followed when using reflow soldering for our SMD devices. Peak temperature must not exceed 260C, and the time above 255C should not exceed 30 seconds. Exceeding these limits could damage the surface finish of the SMD device end may render it inoperable.